Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

Oregon-based TDA Systems has developed a time domain reflectometry (TDR) system to pinpoint faults in ball grid array (BGA) packages. With support from the International Sematech Assembly Analytical ...

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

The current defect inspection systems for packaging are running out of steam for the latest advanced packages, prompting the need for new tools in the market. All of this comes at a time when the ...