Targeted for designers of 3G handsets and wireless datacards, the FAN5902 RF power dc/dc converter is packaged in a 12-bump 0.5-mm-pitch CSP and operates at 6 MHz with a reduced-size 0.5-µH chip ...
resistance of 30 mW after 500,000 cycles, the sockets feature a propagation delay of 45 ps. Available in either a Torlon or Peek body, the sockets feature gold-plated spring probes and stainless-steel ...
Said to be ideal for RF/wireless applications, a new type of wafer scale chip scale packaging (WS-CSP) has been developed to meet increased customer demands. Called Xtreme CSP, the packaging is ...
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