Electronic Design

Dual-Cool Package Technology Enables Power Dissipation Through Top of Package

To meet the needs for high current capability, high efficiency and smaller form factors, Fairchild Semiconductor developed the Dual Cool(tm) packaging for MOSFETs. The Dual Cool package is a top-side ...
Yahoo Finance

Vishay Intertechnology Launches Industry’s First AEC-Q101 Qualified 60 V MOSFET in the PowerPAK® SO-8L Dual Asymmetric Package

MALVERN, Pa., Nov. 09, 2020 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced an AEC-Q101 qualified n-channel 60 V MOSFET that is the industry’s first such device in the ...
Electronic Design

Dual Power MOSFETs in Single Compact Hermetic LCC-6 Surface Mount Package

International Rectifier has introduced the company’s first family of radiation hardened (RAD-Hard) dual power MOSFETs in a compact hermetic LCC-6 surface mount package for low power lightweight space ...
EDN

TI introduces the first discrete dual SerDes to support all CPRI and OBSAI data rates

DALLAS, May 25 /PRNewswire/ — Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced the industry's first 6-gigabit per second (Gbps) dual serializer-deserializer IC (SerDes) that enables ...