Flex Power Modules’ BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with Ball Grid Array (BGA) packaging, as well as in their original compact Land ...
Designed for PBGA, flex BGA, and die-to-die applications, the ABLEBOND 2025 series of electrically insulating die-attach adhesives offer to 260°C IR reliability for lead-free packaging assembly. The ...
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