The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping, which ...

Apple plans to use advanced 3D chip stacking technology in its upcoming MacBook series which is scheduled to be launched in 2025, which is said to be a breakthrough in chip packaging technology. The ...

Samsung plans to replace silicon with glass interposers in AI chip manufacturing by 2028. This groundbreaking shift aims to deliver faster, more efficient AI chips, potentially boosting processing ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting toward advanced ...

LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor ...

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

The two funds target startups in areas such AI and renewable energy across Asia, the U.S. and the EMEA. Kyocera, one of the world’s largest chip component makers, has unveiled two funds totalling $100 ...

MALTA, N.Y. (NEWS10) — GlobalFoundries will create a new center for chip packaging and testing in Malta, the company announced on Friday. The facility will be called the New York Advanced Packaging ...