Semiconductor Engineering sat down with Paul Chou, senior director of security architecture at NVIDIA, to discuss data leakage in heterogeneous designs. What follows are excerpts of that one-on-one ...

It has taken decades of research and development and strong commitment to various industry programs, but the stars are finally aligning for 3D semiconductor systems. No one could have left the 3D & ...

Digital lithography technology (DLT) is promising chipmakers to combine chips with submicron wiring on glass and other large substrates. And this maskless technology is at the center of a strategic ...

The ever-growing scale and speed of High Performance Computing (HPC) systems unleash many new opportunities for researchers and data scientists. Today, the first exascale-capable HPC systems, like the ...

Modern embedded systems are being modeled as Heterogeneous Reconfigurable Computing Systems (HRCS) where reconfigurable hardware i.e. Field Programmable Gate Array (FPGA) and soft core processors acts ...

In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...

The latest trends in software development from the Computer Weekly Application Developer Network. This is a guest post for the Computer Weekly Developer Network written by Peter Bailis in his position ...

Analog and mixed-signal chipmakers are increasingly aiming to integrate analog signal chain with embedded processing platforms to build vertical solutions, and today’s announcement from Analog Devices ...

In this article we will be discussing various aspects of multicore processing, including a look at different types of multicore processors and why these devices are becoming common and popular today.