The change from current price to fair value is due to three key industry inefficiencies. The Wall Street models extrapolate ...

Amkor Technology (AMKR) climbed alongside semiconductor peers after the Philadelphia Semiconductor Index advanced, supported by a market report on flip chip packaging growth prospects and a recent ...

Hanmi Semiconductor, a rising force in semiconductor equipment manufacturing, is rapidly expanding its influence in the AI hardware ecosystem. After establishing dominance in the critical thermal ...

Quick Read Taiwan Semiconductor Manufacturing (TSM) controls advanced packaging capacity that determines which AI chipmakers can scale production. Google reportedly cut its 2026 TPU production target ...

Market reports said most of Kinsus’ advanced production lines are reserved for AI clients, reflecting demand that now ...

Samsung Electronics (OTC:SSNLF) earmarked 25 billion yen ($170 million) to establish an advanced chip packaging R&D center in Yokohama, Japan, intensifying its competition with Taiwan Semiconductor ...

The global semiconductor and IC packaging materials market generated revenue of USD 48.48 billion in 2025, and is projected to grow to USD 114.28 billion in 2034, according to research conducted by ...

Surging demand for artificial intelligence chips is straining global semiconductor supply chains Chipmakers are prioritizing ...

3D packaging is rapidly transforming the semiconductor industry. 3D semiconductor packaging is a sophisticated packaging alternative for semiconductor chips that involve staking of atleast two or more ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...