The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia. By Don Clark Reporting from ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

The U.S. Department of Commerce today announced the launch of a new federal funding competition that aims to spur the research and development of more advanced computer chip packaging technologies.

According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center ...