Higher power density, smaller form factors and long-life reliability expectations all collide, requiring better thermal ...
LG Innotek has announced the development of what it calls the world’s first “next-generation smart IC substrate." ...
LG Innotek has developed a next-generation smart IC substrate that removes precious metal plating, improves durability, and cuts carbon emissions by 50%.
Researchers from the U.S. Department of Energy's (DOE) Brookhaven National Laboratory and DOE's Pacific Northwest National Laboratory (PNNL) have uncovered an unexpected interface layer that may be ...
Prof. Hong Xu's team in Tsinghua University reports a substrate-assisted interfacial polymerization approach to easily prepare a uniform, large-area, and microcontinuous 3D-COF membrane, and ...
The measurement of film thickness holds significance for various manufacturing and research facilities. Fluctuations in the thickness of paint or coating can impact multiple properties crucial to the ...
Surface preparation methods, such as degreasing alone or degreasing followed by abrasion and removal of loose particles, are generally adequate for most adhesive bonding applications. However, to ...
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