System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...

Production test of a finished electronic product often involves two techniques: in-circuit test (ICT) and functional component test (FCT). The ICT technique examines a non-powered circuit board to ...

Even a small array consisting of 100 elements has thousands of individual components that require perhaps 25,000 measurements per module for an eye-watering grand ...

The vulnerability of PERC modules to LID and LeTID is well known and among the reasons the industry is moving towards N-type technology, which tends to be less affected by the two phenomena. TUV Nord ...