One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...
[youtube=http://www.youtube.com/v/c_Qt5CtUlqY&hl=en_US&fs=1&] Take a few minutes to watch this amazingly informative video on how to solder QFN or MLF components ...
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The new QFN socket from Ironwood Electronics features a unique contact design with outside spring and flat stamped plungers. The CBT-QFN-7056 provides a robust solution for burn-in and test ...
You can achieve a lot with a Dremel. For instance, apparently you can slim the original NES down into the hand-held form-factor. Both the CPU and the PPU (Picture Processing Unit) are 40-pin DIP chips ...
MicroLeadFrame (MLF)/ quad flat no-lead (QFN) packaging technology is the fastest growing IC packaging solution today. From a market segment perspective, MLF packaging solutions represent more than a ...
BATAM, Indonesia--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the ...
With over 200 million motors produced every year with fractional horse power, the opportunity to save energy by adopting an electronically controlled variable speed solution is very significant. In ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
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