IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...
IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...
The current trend in the electronics market is to seek solutions with ever-higher levels of integration at an ever lower cost. In this context, the System in Package (SiP) represents the ideal ...
For many years, system-in-package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased ...
PARIS--(BUSINESS WIRE)--Sequans Communications S.A. (NYSE: SQNS), leading provider of LTE for IoT chips and modules, announced that its Monarch SiP (system-in-package) and Monarch GM01Q module, have ...
MUNICH--(BUSINESS WIRE)--Skyworks Solutions, Inc. (Nasdaq: SWKS), and Sequans Communications S.A. (NYSE: SQNS), today introduced the SKY66431, a 5G Massive IoT SiP (system-in-package) solution. This ...
SANTA CRUZ, Calif. — Claiming to offer the first integrated suite of tools for system-in-package design, Cadence Design Systems Inc. this week will roll out an RF SiP Methodology Kit along with ...
SiP (system in package) combined with flexible PCB may be gaining ground in the supply chain of Apple devices, as the vendor reportedly will adopt the combination for its 5G handset battery modules, ...
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