With demand for chip production on an upswing, the U.S. is on track to triple its chip manufacturing capacity by 2032, according to the Semiconductor Industry Association (SIA). It follows that this ...

The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

One of the main challenges in developing semiconductor chip technology is making electronic components smaller and more effective. This difficulty is most noticeable in lithography, which is the ...

Third-party sensors are being added into fab equipment to help boost yield and to extend the life of expensive tools, supplementing the sensors that come with equipment used in fabs. The data gleaned ...

A bare wafer stacker sorts silicon wafers in Building 51 at Micron Technology Inc. headquarters in Boise, Idaho, US, on Monday, June 10, 2024. The US announced in April its plans to award Micron ...