System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Bulk molding compound (BMC) is a ready-to-mold, glass-fiber reinforced thermoset polymer material used in compression molding, along with injection molding and transfer molding. BMC is manufactured by ...

A large lot of plastic-packaged ICs is on its way to surface-mounting. The components have passed electrical inspection, where those having functional defects were removed. They have passed optical ...

Compounds with different base elastomers and fillers will exhibit drastically different viscoelastic properties. This has a great impact on processing operations such as extrusion, calendering and ...