Test Socket's CAM Lid Guards Package Pads Damage to package pads is preventable thanks to a line of high-frequency test sockets. These sockets feature a computing-aided manufacturing (CAM) lid that ...
Frenchtown, N.J. – Aries Electronics says the spring-loaded lids on its RF test sockets offer consistent lead pressure on every socket. Precise pressure requirements can be met with mix-and-match ...
Ironwood Electronics has released a new test socket for BGA devices; it features a clamshell lid design for ease of chip replacement in the production environment. Besides final production test, the ...
Test and burn-in of integrated circuits can be performed by a new socket that accommodates packages from 41 mm2 to 55 mm2. This covers ICs such as SRAMs, DRAMs, DSPs and flash memories. Packages that ...
Advanced AI/CPU processors demand extreme high frequency and power performance from SLT and ATE test sockets. These sockets are in the critical path at the end of a very costly silicon fabrication and ...
As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
Smiths Interconnect is using system simulation models to create custom heat removal lids for ICs under test. “Traditional solutions including finned and liquid cooled heatsinks have been industry ...
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