SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co. Ltd, a world leader in advanced semiconductor technology, today announced that it has initiated mass production of its new automotive ...

On that front, Micron is leading the pack with its low-power double data rate 5X (LPDDR5X) DRAM and Universal Flash Storage (UFS) 3.1, designed to deliver next-gen speeds and performance in the ...

Samsung has announced that it has started mass production of its new Samsung Automotive UFS 3.1 Memory Solution, the device is designed for use in cars and it will be available in 128GB, 256GB, and ...

Samsung Electronics aims to become the world's top vendor of automotive memory products by 2025 after entering mass production of its new automotive universal flash storage (UFS) 3.1 memory solution ...

Micron Technology, Inc. has announced that its low-power double data rate 5X (LPDDR5X) DRAM and Universal Flash Storage (UFS) 3.1 embedded solutions are qualified on Qualcomm Technologies’ latest ...

Micron has announced that it is sending samples of its latest Universal Flash Storage (UFS) 4.0 ICs to smart device makers. Devices using these new NAND chips will benefit from double speed transfers ...

What if the storage in your single-board computer (SBC) could rival, or even surpass, the speeds of some NVMe SSDs, all while consuming less power and requiring simpler hardware? This is no longer a ...

TL;DR: KIOXIA has launched next-generation UFS 4.1 memory devices designed for automotive applications, featuring 8th generation BiCS FLASH 3D technology and an in-house controller. These devices ...

UFS has quickly outpaced the capabilities of e-MMC, as speed, performance, and density of mobile devices continues to delight users and drive demand. Read about UFS features, advantages, and 5G ...

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced that it has begun sampling (1) new Universal Flash Storage (2) (UFS) Ver. 4.1 embedded memory devices ...