For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...
Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, ...
Sustainable electronics require eco-friendly energy storage systems with long-term stability and regeneration. Here, the authors present an eco-friendly, self-healing supercapacitor that uses a ...
Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...
Abstract: A multiphysics hierarchical optimization strategy is proposed to enhance the optimization efficiency and quality of high-power-density permanent magnet (PM) machines. The analytical models ...
Credit: Gorodenkoff/Shutterstock Enhances system-level engineering with expanded digital twin capabilities and connected modeling workflows that deliver deeper real ...
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