Creative Bloq on MSN
How I turned Singed from Arcane into a 3D model suitable for video game design
This was my process to retain Arcane's stylised shapes and painterly textures.
Abstract: The impedance of a power-distribution network (PDN) in three-dimensionally stacked chips with multiple through-silicon-via (TSV) connections (a 3D TSV IC) was modeled and analyzed using a ...
This repository contains the code for the thermal RC and Discrete State Space (DSS) models for 2.5D and 3D chiplets. These models are part of our multi-fidelity thermal modeling for 2.5D and 3D ...
Institute of Terrestrial Ecology, Swiss Federal Institute of Technology Zürich (ETHZ), Grabenstrasse 11a, CH-8952 Schlieren, Switzerland, Department of Rural Engineering, Air and Soil Pollution ...
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