Improved contact resistance and RF output key toward mobile-compatible E-mode GaN-on-Si transistors www.imec-int.com, Jun. 12, 2025 – LEUVEN (Belgium), June 12, 2025 — Imec, a world-leading research ...

The new Qualcomm facility, staffed by scientists and AI experts in both Hanoi and Ho Chi Minh City, is part of company's global AI research division www.rcrwireless.com, Jun. 11, 2025 – U.S.-based ...

Veriest Explore AI-Driven EDA Innovation and Next-Generation Verification www.veriest.com, Jun. 22, 2025 – San Francisco, CA -- June 22, 2025 - Veriest Solutions, a leading provider of engineering ...

The AlphaCHIP1600-IO chiplet has been purpose-built for use in SiPs (System-in-Packages) targeting these next-generation ...

Consider, for instance, the huge population of CPU and DSP architectures that existed in the year 2000. The image below shows ...

Today, many companies are developing multi-die systems. Some, like AMD, Intel, and Nvidia, manage the entire development ...

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced three new high-voltage 650V GaN FETs for AI data centers and server ...

The chiplet economy rests on three fundamental pillars: deployment, innovation, and manufacturing, each presenting distinct opportunities and challenges.

Arteris recently announced the expansion of its multi-die IP solution. The new upgrades to the company’s network-on-chip (NoC) IP library include the FlexNoC Network-on-Chip with CodaCache Last-Level ...

As the race toward 2nm nodes and advanced 3D architectures intensifies, the use of AI for discovery of new materials will be key to achieving a competitive advantage. From mobile processors to memory ...

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the 2024 MIPI Alliance Membership Award recipients, ...

Ceva’s RealSpace® Spatial Audio software is designed for low power consumption, efficient compute, and seamless integration into wireless audio devices. It delivers cinematic 3D sound with dynamic ...