Leveraging IsoShield multichip packaging, TI’s isolated power modules deliver up to 3× the power density of discrete devices.

The 40 LHE linear position sensor from Vishay measures strokes from 0 to 40 mm with ±1% full-stroke accuracy. Using Hall ...

Deepak Shankar, founder of Mirabilis Design and developer of VisualSim Architect platform for chip and system designs, has ...

Infineon’s TDM24745T quad-phase power module with TLVR magnetics provides high current density for AI workloads.

Here is a sneak peek at the AI content in EDA and how it comprises four camps, all missing the real opportunity.

An LM555 timer paired with an NTC thermistor makes a simple, configurable ON/OFF thermostat for heating or cooling.

Power device manufacturers exhibit their latest advances in topologies, packaging, and solutions at APEC 2026.

To understand what's really happening, we need to look at the full system, specifically total cost of ownership of an AI ...

CPO integrates optical components directly into a package, replacing long copper traces with shorter connections.

Arm is now a chip vendor—what does it mean for the semiconductor industry? EE Times’ Nitin Dahad was at the event in San ...

Minor adjustments to switching frequency, thermal management, bias power, and inductor selection improves 48V buck converter ...

How easy is it to optimize how much power the device connected to a smart plug is drawing? Depends on which firmware version you’re running.