Abstract: Heat dissipation is a critical issue in a backside power delivery network (BSPDN) chip package because heat from the powered transistors must travel through the signal interconnects (that ...
LeBrun is a Maryland-based freelance writer with a bachelor's degree in communications. She is a member of the Association of Health Care Journalists and the American Society of Journalists and ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results