Abstract: Three-dimensional stacked integration based on through-silicon via (TSV) meets the high-speed development requirements of integrated circuits (ICs). However, TSV is a sensitive unit prone to ...
Compact heat exchangers could enable advanced nuclear reactors that are smaller, more efficient and more affordable—but a ...
Abstract: The degree of polymerization value (DPv) is a widely recognized indicator of oil–paper insulation degradation in power transformers. However, conventional DPv estimation relies on invasive ...
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