Interesting Engineering on MSN

New chip-scale optical wireless system reaches 362 Gbps with lower energy use

Researchers have developed a chip-scale optical wireless system that delivers ultra-fast data speeds while ...
Semiconductor Engineering

Research Bits: Mar. 31

D hard mask material; defect identification; extreme photonic packaging.
Tech Xplore on MSN

Photonic chip packaging can withstand extreme environments

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic ...