Leveraging IsoShield multichip packaging, TI’s isolated power modules deliver up to 3× the power density of discrete devices.

Infineon’s TDM24745T quad-phase power module with TLVR magnetics provides high current density for AI workloads.

The 40 LHE linear position sensor from Vishay measures strokes from 0 to 40 mm with ±1% full-stroke accuracy. Using Hall ...

An LM555 timer paired with an NTC thermistor makes a simple, configurable ON/OFF thermostat for heating or cooling.

Deepak Shankar, founder of Mirabilis Design and developer of VisualSim Architect platform for chip and system designs, has ...

Here is a sneak peek at the AI content in EDA and how it comprises four camps, all missing the real opportunity.

Power device manufacturers exhibit their latest advances in topologies, packaging, and solutions at APEC 2026.

To understand what's really happening, we need to look at the full system, specifically total cost of ownership of an AI ...

How easy is it to optimize how much power the device connected to a smart plug is drawing? Depends on which firmware version you’re running.

QSiC Dual3 1200-V half-bridge MOSFET modules from SemiQ address the efficiency and thermal demands of liquid-cooled AI data centers.

NXP’s TEF8388 RF CMOS automotive radar transceiver supports Level 2+ and Level 3 ADAS, with a roadmap toward higher levels of automation.

Semtech’s TDS5311P circuit protection device delivers near-constant clamping voltage for 48-V USB PD EPR applications.